发明名称 Pattering method
摘要 The invention provides a method of pattering a substrate, in which a first material in solution is deposited on the substrate. The composition of the solution of the first material is selected so it dries to leave a residue of the first material on the substrate, the residue comprising a thin film in the centre and a ridge around the perimeter. The residue is etched to remove the thin film, leaving the ridge on the substrate. After etching the ridge is hydrophobic and the substrate is hydrophilic. An aqueous solution of a second material is then deposited on both sides of the ridge. After the aqueous solution has dried, the ridge is removed, leaving a layer of the second material on the substrate, the layer having a narrow gap therethrough. The layer may be used for the source and drain electrodes of an organic thin film transistor.
申请公布号 US2004029382(A1) 申请公布日期 2004.02.12
申请号 US20030275318 申请日期 2003.01.29
申请人 KAWASE TAKEO 发明人 KAWASE TAKEO
分类号 H01L51/50;H01L21/288;H01L21/336;H01L29/786;H01L51/00;H01L51/05;H01L51/40;H05B33/14;(IPC1-7):H01L27/01 主分类号 H01L51/50
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