PICK AND PLACE MACHINE WITH COMPONENT PLACEMENT INSPECTION

摘要

Improved component placement inspection and verification is performed by a pick and place machine (301). Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s) (208, 210, 212); optics (380) to allow image acquisition device (300, 302) to view the placement location (360) from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component (304); techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.