发明名称 |
IC card and semiconductor integrated circuit device package |
摘要 |
An IC card includes a base card and a semiconductor integrated circuit device package. The semiconductor integrated circuit device package has one surface and the other surface disposed opposite to the one surface. In one surface, a plurality of card terminals which can re-contact terminals of an electronic device are disposed. The base card includes a concave portion. The other surface is attached to a bottom of the concave portion of the base card.
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申请公布号 |
US2004027809(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030442959 |
申请日期 |
2003.05.22 |
申请人 |
TAKAHASHI TAKUYA;YAMAMOTO KAZUHIRO;OHARA MINORU |
发明人 |
TAKAHASHI TAKUYA;YAMAMOTO KAZUHIRO;OHARA MINORU |
分类号 |
G06K19/077;H01L23/498;(IPC1-7):H05K1/14 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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