发明名称 |
ELECTRODEPOSITED COPPER FOIL AND ELECTRODEPOSITED COPPER FOIL FOR SECONDARY BATTERY COLLECTOR |
摘要 |
PURPOSE: Provided are an electrodeposited copper foil with a low surface roughness and an electrodeposited copper foil suitable for the collector of a cathode of a secondary battery. CONSTITUTION: The electrodeposited copper foil has a surface roughness at a deposition surface at ordinary temperature smaller than 2.5 micrometer in terms of 10 point average roughness Rz, a minimum distance between base foil peaks of at least 5 micrometer, an ordinary temperature tensile strength of not more than 40 kg/mm2, and a drop in ordinary temperature tensile strength after heat treatment at 130 deg.C for 15 hours of less than 15%. The foil does not soften under heat after the heat treatment. The elongation rate at ordinary temperature is at least 14% at a thickness of 35 micrometer and the elongation rate increases along with a rise in temperature in an atmosphere from ordinary temperature to 200 deg.C. |
申请公布号 |
KR20040012601(A) |
申请公布日期 |
2004.02.11 |
申请号 |
KR20030053500 |
申请日期 |
2003.08.01 |
申请人 |
FURUKAWA CIRCUIT FOIL FOIL CO., LTD. |
发明人 |
OTSUKA HIDEO;SUZUKI AKITOSHI |
分类号 |
C25D1/04;C25D3/38;C25D7/06;H01M4/36;H01M4/64;H01M4/66;H01M4/70;H01M10/0525;H01M10/24;(IPC1-7):H01M4/66 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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