| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for picking up a chip on a wafer sheet which can eliminate a needle for pushing up the chip on the wafer sheet from below. SOLUTION: The upper surface of an outer case 3 is brought into contact with a lower surface of the wafer sheet 1, and the wafer sheet 1 at the side of the chip 2 on an inner case 4 is vacuum sucked to an opening 22 of the case 3 by a first pump 24. The chip 2 on the inner case 4 is vacuum sucked by a nozzle 9 for picking up the chip, and the nozzle 9 is raised. In this case, the wafer sheet 1 of a lower surface of the chip 2 is vacuum sucked from a hole 7 by a second pump 26, and the sheet 1 is released from a lower surface of the chip 2 by its suction. Desirably, the case 4 is vibrated with an ultrasonic vibrator 21, bubbles are generated in the bond for sticking the chip 2 to the sheet by cavitation, and hence a sticking of the chip 2 is released. COPYRIGHT: (C)2004,JPO
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