| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the heterogenic phenomenon of etching in conveying direction at the upper surface side of plurality of substrates by providing a film for connecting the substrates having a single layer structure and such strength as not to separate the substrates at the etching part when the plurality of substrates are connected and etched while conveying. SOLUTION: In the method for etching the plurality of substrates horizontally conveyed with a conveying means, both edge parts in the conveying direction of respective abutted substrates are mutually connected with the film for connecting the substrates forming a positive type resist-film in a belt-like, and while conveying the respective substrates under connecting state, at least the etching treatment and resist-removal are performed. Then, the film for connecting the substrates is removed with resist-removing liquid etc., used for removing the resist to separate the respective substrates. COPYRIGHT: (C)2004,JPO
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