| 摘要 |
An electronic component package according to the present invention includes a case (1) having a cavity portion containing an electronic component therein, and a lid member (8) fusion-welded to the case (1) via a fusion-welding layer (20) to close the cavity portion hermetically. The case (1) has a first metal layer (5) laminated on the case (1) in a manner to be exposed on the cavity open side. The lid member (8) has a core portion (9), and a second metal layer (10) laminated on a side of the core portion (9) facing the case (1). The fusion-welding layer (20) has a soldering material layer (12A) formed of a soldering material, and first and second intermetallic compound layers (5A) and (10A), respectively, formed on opposite sides of the soldering material layer (12A) as a result of diffusion of a major component of the soldering material into the first metal layer (5) and the second metal layer (10). The ratio of the area of the first and second intermetallic compound layers (5A) and (10A) in a longitudinal section of the fusion-welding layer (20) to the area of the longitudinal section of the fusion-welding layer (20) is in a range of from 25 to 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material. |
