| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for isolating resin and metal in a printed board capable of effectively isolating and recovering resin, wherein a printed board including thermoplastic resin as resin used is recycled as a waste printed board. <P>SOLUTION: The isolating apparatus for isolating resin and metal in a printed board is adapted such that a resin material 2a and a wiring metal material 2b are isolated from a waste electronic product or from a waste printed board 100 as a waste material produced in a manufacturing process for an electronic product. The isolating apparatus further comprises pressurizing means M1 for pressurizing the waste printed board 100, heating means M2 for heating the waste printed board 100 to a predetermined temperature where it can be at least softened, and filtration means M3 for filtrating the resin material 2a from the waste printed board 100 kept at a predetermined temperature with the aid of the heating means M2. <P>COPYRIGHT: (C)2004,JPO</p> |
