| 摘要 |
PROBLEM TO BE SOLVED: To improve the availability of electronic component contact bonding equipment by prolonging the service life of a detector. SOLUTION: This electronic component contact bonding equipment is provided with a contact bonding head 5 which pushes an electronic component 2 on a substrate 3, a cylinder device 12 for applying a pressure to the contact bonding head 5, and a pressure detecting unit 20 which is arranged between the cylinder device 12 and the contact bonding head 5 and detects the pressure which is applied to the contact bonding head 5 by the cylinder device 12. The pressure detecting unit 20 is provided with a load cell 24 for detecting the pressure which is applied to the contact bonding head 5 by the cylinder device 12, and a screw shaft 33 which selectively positions the load cell 24 in a pressure transmission pathway from the cylinder device 12 to the contact bonding head 5 and outside the pathway. COPYRIGHT: (C)2004,JPO
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