| 发明名称 |
WORKING METHOD FOR THIN WORKPIECE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material removing working method for a flat workpiece capable of achieving high throughput and a highly smooth workpiece. <P>SOLUTION: During the working of the workpiece, the workpiece load by the pressure is sharply decreased at least once and then increased again while the amount of auxiliary material supplied is decreased as the pressure increases. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004034285(A) |
申请公布日期 |
2004.02.05 |
| 申请号 |
JP20030189678 |
申请日期 |
2003.07.01 |
| 申请人 |
WACKER SILTRONIC AG |
发明人 |
HEIMES TIMON;DUMM HERMANN |
| 分类号 |
B24B57/02;B24B7/17;B24B37/04;B24B49/16;H01L21/304;H01L21/306 |
主分类号 |
B24B57/02 |
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