发明名称 |
Thermally-enhanced integrated circuit package |
摘要 |
A packaged integrated circuit including a substrate 520 including a metal grid 570, 580 over a top surface of the substrate and an integrated circuit chip 500 mounted on the substrate over the grid. The metal grid can be electrically isolated from the integrated circuit or it can be electrically connected to the integrated circuit, through electrical ground for example.
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申请公布号 |
US2004021213(A1) |
申请公布日期 |
2004.02.05 |
申请号 |
US20020212501 |
申请日期 |
2002.08.05 |
申请人 |
LOW SHIN SHERN;PIERCE MIKE |
发明人 |
LOW SHIN SHERN;PIERCE MIKE |
分类号 |
H01L23/12;H01L23/36;H01L23/367;H01L23/433;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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