| 摘要 |
1,098,534. Soldering. SIEMENS A.G. Sept. 5, 1966 [Sept. 6, 1965], No. 39556/66. Heading B3R. [Also in Division H1] In a process for attaching a semiconductor device to its current supply leads, the base electrode 1 of the device is first welded to lead 11 and the remaining leads 12, 13 are then bent into contact with the emitter and collector electrodes 2, 3 and joined thereto using hydrogen flames. The electrodes 2, 3 are made of indium-gallium or indiumgallium-aluminium alloy and the leads of copper-sheathed wire which may be coated with gold. The flames employed preferably have a length of between 1 and 5 cm. and the joining is performed in the reducing zone at a temperature of about 200‹ C. when the indium alloy melts and flows over the leads 12, 13, the duration of the heating being 0À3 to 0À5 seconds. The invention may be used for attaching leads to other electrical components, e.g. the grids in electron tubes. |
