发明名称 |
METHOD FOR FABRICATING FLASH MEMORY |
摘要 |
PURPOSE: A method for fabricating a flash memory is provided to reduce the number of fabrication processes by forming a low-voltage transistor and a high-voltage transistor of a peripheral circuit region with the same DDD(Double Doped Drain) structure. CONSTITUTION: An isolation layer is formed on a substrate(302). A well region is formed on the substrate by performing a well ion implantation process and a threshold voltage ion implantation process. A gate is formed thereon. A mask is formed on a main cell region to open a peripheral circuit region. A low-density junction region(314,316) is formed by implanting ions into a high-voltage region and a low-voltage region. A spacer(318,320) is formed on a sidewall of the high-voltage region and the low-voltage region. A mask is formed on the main cell region to open the peripheral circuit region. A high-density junction region(322,324) is formed by implanting the ions into the high-voltage region and the low-voltage region.
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申请公布号 |
KR20040008520(A) |
申请公布日期 |
2004.01.31 |
申请号 |
KR20020042159 |
申请日期 |
2002.07.18 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN, JEONG RYEOL;JUNG, SEONG MUN;LEE, YEONG BOK |
分类号 |
H01L27/115;H01L21/8247;H01L27/105;(IPC1-7):H01L27/115 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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