发明名称 MATERIAL STACK APPARATUS AND MATERIAL STACK METHOD
摘要 PROBLEM TO BE SOLVED: To provide a material stack apparatus capable of forming foil chip materials in a tilt state into a mold with a uniform thickness, and a material stack method. SOLUTION: The material stack apparatus A is configured with: the mold 25 for forming a layer of the foil chip materials; a moving unit 23 for reciprocating the mold 25 in horizontal directions; and a material supply unit 30 for falling down the foil chip materials from a tip of a shoot 33 to supply the foil chip materials in the mold 25. In addition, driving a linear feeder 32 enables the transfer of the foil chip materials. Moreover, the shoot 33 is provided with a screen 35 to supply only the foil chip materials with a prescribed size to the mold 25. Further, a baffle plate 45b of a splash preventing unit 40 is provided in the vicinity of the tip of the shoot 33. Further, when the reciprocated mold 25 is at a reverse position, the supply of the foil chip materials from the material supply unit 30 is stopped. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031873(A) 申请公布日期 2004.01.29
申请号 JP20020189848 申请日期 2002.06.28
申请人 YAMAHA CORP;ZENWELL ORDERED KK 发明人 YAMASHITA HIROYUKI;OZAWA TATSUHIRO;NAKADA SEIJI;UCHIYAMA NORIYUKI
分类号 B22F3/035;H01L35/16;H01L35/34;(IPC1-7):H01L35/34 主分类号 B22F3/035
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