Patching process for degraded portion of metallic workpiece e.g. pipe and conduit, involves electroplating reinforcing metallic patch to cover degraded portion
摘要
<p>A reinforcing metallic patch is electroplated to cover the degraded portion without covering the non-degraded portion of metallic workpiece, where the electrodeposited metal of metallic patch has an average grain size of 1000 nm or less. An independent claim is also included for process for in-situ electroforming structural reinforcing layer.</p>
申请公布号
DE10228323(A1)
申请公布日期
2004.01.29
申请号
DE2002128323
申请日期
2002.06.25
申请人
INTEGRAN TECHNOLOGIES INC., TORONTO
发明人
PALUMBO, GINO;ERB, UWE;MCCREA, JONATHAN;HIBBARD, GLENN D.;BROOKS, IAIN;GONZALEZ, FRANCISCO;TOMANTSCHGER, KLAUS