MICROWAVE BONDING ON THIN FILM METAL COATED SUBSTRATES
摘要
<p>Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films (102) are placed within a microwave cavity (110) containing other less microwave absorbing materials (100, 104) ,and excited to cause selective heating in the skin depth (101) of the films (102). This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.</p>
申请公布号
WO2004010739(A1)
申请公布日期
2004.01.29
申请号
WO2003US19620
申请日期
2003.06.20
申请人
CALIFORNIA INSTITUTE OF TECHNOLOGY;BARMATZ, MARTIN, B.;MAI, JOHN, D.;PIKE, WILLIAM, T.;BUDRAA, NASSER, K.;JACKSON, HENRY, W.
