发明名称 SYSTEM AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a system and method for treating substrates by which a stable flow rate of ozone gas having a stable ozone concentration can be generated even if ozone gas is fed to a plurality of chambers. SOLUTION: This system for treating substrates comprises an ozone gas generator 42 for generating ozone gas by discharging in oxygen-containing gas, and a plurality of chambers 30A, 30B for separately housing substrates W. Ozone gas is fed into the chambers 30A, 30B to separately treat the substrate W. Further, the system has gas flow rate regulators 188, 191 for regulating the flow rate of the oxygen-containing gas fed to the ozone gas generator 42, and a controller 201 for controlling the gas flow rate regulators 188, 191. The total flow rate of the ozone gas fed to the plurality of the chambers 30A, 30B is controlled by controlling the flow rate of the oxygen-containing gas by the controller 201. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031654(A) 申请公布日期 2004.01.29
申请号 JP20020185992 申请日期 2002.06.26
申请人 TOKYO ELECTRON LTD 发明人 NAGANO YASUHIRO;ITO KIKO
分类号 G03F7/42;H01L21/00;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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