| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a transmission line filter in which a filter can be designed except 2-dimensional development, particularly, not only the filter stronger in a high frequency range can be manufactured, but also a motherboard or an IC package can be miniaturized. <P>SOLUTION: The transmission line filter is characterized in that a transmission line in which characteristic impedance inside a layer having two layers or more is different is connected by a connection structure by continuous connection by vias. <P>COPYRIGHT: (C)2004,JPO</p> |
