| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film excellent in high elastic modulus, flexibility and film forming property when applied to the substrate of a metal circuit board such as a flexible printed circuit, a CSP, a COF, a BGA or a TAB tape on the surface of which a metal circuit is made, and to provide a method for producing the same and to provide a metallic wiring board using the same as a base. SOLUTION: The polyimide film comprising mainly pyromellitic acid dianhydride as the acid component and oxydianiline as the diamine component, contains total≤2 ppm of sodium, potassium, nickel, palladium and platinum, and produced by preferably using the oxydianiline purified by distillation, recrystallization in a solvent. COPYRIGHT: (C)2004,JPO |
