| 发明名称 |
Conductive inks for metalization in integrated polymer microsystems |
| 摘要 |
A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).
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| 申请公布号 |
US2004018297(A1) |
申请公布日期 |
2004.01.29 |
| 申请号 |
US20030371912 |
申请日期 |
2003.02.20 |
| 申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
DAVIDSON JAMES COURTNEY;KRULEVITCH PETER A.;MAGHRIBI MARIAM N.;BENETT WILLIAM J.;HAMILTON JULIE K.;TOVAR ARMANDO R. |
| 分类号 |
H01L23/14;H01L23/538;H05K1/00;H05K1/03;H05K1/09;H05K3/10;H05K3/12;(IPC1-7):B05D5/12;B05D3/12;B05D1/32 |
主分类号 |
H01L23/14 |
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