| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, capable of keeping a height of a wire loop of low. <P>SOLUTION: This structure comprises a semiconductor chip 2 mounted to a die pad 1; a lead terminal 6 for connecting this semiconductor chip 2 with an external circuit; a wire 7 of which one end is connected to a pad 4 of the semiconductor chip 2, another end is connected to the lead terminal 6, and a middle part is turned back on an opposite side of the lead terminal of the pad 4; the pad 4; and a sealing resin 8 for sealing a part of the lead terminal 6 and the wire 7. <P>COPYRIGHT: (C)2004,JPO |
