| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape with an adhesive agent for semiconductor that is superior in reflow resistance and can reduce warpage and a copper-clad laminate using the same, and a semiconductor device. <P>SOLUTION: The tape with an adhesive agent for semiconductor comprises a laminated body formed of an organic insulation film layer and at least one layer of adhesive agent, and the insulation film layer has a saturated expansion coefficient of 0.1% or less at 25°C and 55% RH, and its saturation reaching time is 24 hours or less, its coefficient of elasticity is 4GPa or more, and its linear expansion coefficient is 18ppm/°C or more. <P>COPYRIGHT: (C)2004,JPO |
