| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module having highly reliable junctions though low in cost, and to provide a method for manufacturing the same. SOLUTION: The thermoelectric module has supporting substrates 1, 2, a plurality of thermoelectric elements 5, and solder layers 6 sandwiched between the thermoelectric elements 5 and the supporting substrate 1, 2. The area of voids 8 in the solder layers 6, as projected on the main surface of the supporting substrate 1 or 2, accounts for 1-20% of the total area of the solder layers 6. It is preferred in particular that the solder layers 6 have a thickness of 10-50μm and that the diameters of the voids 8 be 0.1-50μm on the average. COPYRIGHT: (C)2004,JPO |
