发明名称 Surround-gate semiconductor device encapsulated in an insulating medium
摘要 A semiconductor device is provided that includes a semiconductor channel region extending above a semiconductor substrate in a longitudinal direction between a semiconductor source region and a semiconductor drain region, and a gate region extending in the transverse direction, coating the channel region, and insulated from the channel region. The source, channel, and drain regions are formed in a continuous semiconductor layer that is approximately plane and parallel to the upper surface of the substrate. Additionally, the source, drain, and gate regions are coated in an insulating coating so as to provide electrical insulation between the gate region and the source and drain regions, and between the substrate and the source, drain, gate, and channel regions. Also provided is an integrated circuit that includes such a semiconductor device, and a method for manufacturing such a semiconductor device.
申请公布号 US2004016968(A1) 申请公布日期 2004.01.29
申请号 US20030409653 申请日期 2003.04.08
申请人 STMICROELECTRONICS S.A. 发明人 CORONEL PHILIPPE;MONFRAY STEPHANE;SKOTNICKI THOMAS
分类号 H01L21/336;H01L29/786;(IPC1-7):H01L21/84;H01L31/039 主分类号 H01L21/336
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