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发明名称
High performance multi-chip IC package
摘要
申请公布号
EP1122786(A3)
申请公布日期
2004.01.28
申请号
EP20010300535
申请日期
2001.01.22
申请人
LUCENT TECHNOLOGIES INC.
发明人
YINON, DEGANI;DUDDERAR, THOMAS DIXON;TAI, KING LIEN
分类号
H01L23/12;H01L23/36;H01L23/50;H01L25/065;H01L25/07;H01L25/18;H05K1/14;H05K1/18;H05K3/34;(IPC1-7):H01L25/065
主分类号
H01L23/12
代理机构
代理人
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地址
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