发明名称 Method and apparatus for measuring energy consumed during plastic deformation in multi-ply board systems
摘要 A method and an apparatus for predicting a score-line cracking propensity of a multi-ply substrate. The method includes the steps of: bending the multi-ply substrate; acquiring tensile load data from the multi-ply substrate during bending; and computing a material property of a top ply of the multi-ply substrate based on the acquired tensile load data. The material property must show a strong correlation to the score-line cracking propensity of the multi-ply substrate. The material property which is computed is the energy consumed in plastic deformation of the top ply during the fracture process. The measurement results can be used to predict score-line cracking propensity in multi-ply board systems, such as multi-ply paperboard.
申请公布号 US6684167(B2) 申请公布日期 2004.01.27
申请号 US20010855325 申请日期 2001.05.15
申请人 INTERNATIONAL PAPER COMPANY 发明人 HAMAD WADOOD;HULBERT ROBERT A.;KENT HENRY J.
分类号 G01L1/04;G01N3/00;G01N3/02;G01N3/20;G01N33/34;G05D3/12;G05D5/00;G05D9/00;G05D11/00;G05D17/00;G06F7/66;G06F19/00;(IPC1-7):G01L1/04 主分类号 G01L1/04
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