| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the occurrence of shortcircuit of wiring which is caused by stress and imperfect cutting in a semiconductor device having the wiring and bump electrodes which are connected with connection pads on a semiconductor substrate. <P>SOLUTION: Slits 8 are arranged on a re-wiring 5 which is arranged having a pattern surrounding the bump electrodes 6a and the connection pads 2, so that generated thermal stress is dispersed by the slits 8 and can be relived even if the thermal stress is generated by difference between coefficients of thermal expansion of the re-wiring 5 and a sealing film 7. As a result, cracks which are developed on the re-wiring 5 and the sealing film 7 by thermal stress can be prevented. <P>COPYRIGHT: (C)2004,JPO</p> |
