| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a ceramic board for high-frequency use and to stabilize the state of the ceramic board, as installed on a motherboard, by installing the ceramic board on a resin board. SOLUTION: Electronic parts 7, 8, 9, having a self-resonant frequency of approximately 5-6 GHz, are mounted on a resin board 2 by soldering. A semiconductor device 17 for processing signals at in frequency higher than the self-resonant frequency is mounted on a ceramic board 13 by wire bonding or the like, and the ceramic board 13 is installed on the resin board 2. As a result, a resin board 2 can now be installed stable on a resin-made motherboard 19 or the like, with the number of parts reduced on the ceramic board 13 for a reduction in the size of the ceramic board 13. The semiconductor device 17 may be mounted in a process different from the process for mounting the electronic parts 7, 8, 9 and the ceramic board 13, and this prevents connection failure in a wire 17A otherwise to occur due to flux or the like in solders 10, 16. COPYRIGHT: (C)2004,JPO |
