| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer supporting tool capable of suppressing warping of a wafer and simultaneously supporting the wafer, and to provide a semiconductor device manufacturing method using the supporting tool. SOLUTION: The supporting tool 1 is provided with an annular first support member 10 and an annular second support member 30. The first support member 10 has an annular first support surface 52. A wafer 2 is mounted on the first support surface 52, and the second support member 30 is disposed therefrom. Thus, an outer periphery of the wafer 2 is pinched in a thickness direction between the annular first support surface 52 and a second support surface 56 provided in the second support member 30. In the wafer 2 set to the supporting tool 1, both surfaces of a front surface 2a and a rear surface 2b are exposed from an aperture 50 in an inward direction of a supporting jig 50. At the end surface of the back of the first support member 10, a groove 20 led from an outer periphery of the supporting tool 1 to the aperture 50 is provided. COPYRIGHT: (C)2004,JPO |
