| 摘要 |
<P>PROBLEM TO BE SOLVED: To attach a heat sink to an element in a radio-frequency microcircuit, without impairing the electrical insulating properties of a module. <P>SOLUTION: The above problem is solved by heat sink equipment for providing electrical insulating properties to an integrally shielded electronic circuit, comprising a substrate having a first hole extending between first and second surfaces, a conductive layer attached to the second surface, an electrically and thermally conductive heat sink attached to the first surface and having a protrusion. The heat sink is attached to the first surface of the substrate and includes a conductive plate through which a second hole penetrates. The protrusion runs through the first hole and has a surface which is substantially flush with the conductive layer. Electronic components can be attached to the surface of the protrusion. The plate is electrically connected to the conductive layer and the surface of the protrusion, thereby the open space between the protrusion and the conductive layer is covered by the conductive region of the plate. <P>COPYRIGHT: (C)2004,JPO |
