发明名称 APPARATUS FOR TREATING SUBSTRATE AND NOZZLE FOR SUPPLYING TREATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate which supplies the substrate with a treating liquid that is prepared by diluting an adding fluid with a diluting fluid without using a mixing tank. SOLUTION: In the treating apparatus in which the substrate is treated with the treating liquid sprayed from the nozzle, there are provided a nozzle main body, a mixing chamber 68 installed in the nozzle main body, a spraying part 69 communicating with the mixing chamber, a first connected hole 65, installed in the nozzle, for supplying the diluting fluid to the mixing chamber, a second connected hole 66, installed in the nozzle, for supplying the adding fluid to be diluted with the diluting fluid, and a third connecting hole 67, installed in the nozzle, for supplying a pressurized gas from the spraying part for pressurizing and spraying the treating liquid prepared by dilution of the adding fluid with the diluting fluid in the mixing chamber. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004016878(A) 申请公布日期 2004.01.22
申请号 JP20020173209 申请日期 2002.06.13
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISO AKINORI
分类号 B08B3/02;B05B1/00;B05B7/04;H01L21/027;H01L21/304;(IPC1-7):B05B7/04 主分类号 B08B3/02
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