Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board

摘要

The invention provides a system and method for assembling an electrical module. The module comprises a circuit board, a substrate and an electrical component carried on the substrate. The substrate is formed by a stamping process an is mounted at a location on the circuit board. The substrate forms part of an electrical circuit with a circuit in the circuit board and dissipates heat from the circuit board. The substrate and the circuit board are both initially carried in respective frames. Alignment registered in the frames allow the frames to be aligned such that the substrate is positioned at the location on the circuit board.