| 摘要 |
PROBLEM TO BE SOLVED: To reduce internal stress generated in an active layer near a base and to improve reliability in semiconductor laser equipment. SOLUTION: Semiconductor laser equipment is provided with a semiconductor laser element 1 having a ridge structure part 1a which protrudes in accordance with the active layer 18 near the base, a mounting board 8 where the semiconductor laser element 1 is mounted on an upper face, an electrode film 11 formed on the base of the semiconductor laser element 1, an electrode film 13 formed on the upper face of the mounting board 8 by facing the electrode film 11 and solder layers 6 arranged between the films 11 and 13 and are bonded. Concave grooves 1b positioned on both sides of the active layer 13 and the ridge structure 1a are formed in the semiconductor laser element 1. The electrode film 11 comprises surfaces of the ridge structure 1a, and the concave grooves 1b and are formed to extend on both sides. The solder layers 6 are formed on both sides of the concave grooves 1b so that they have spaces facing the ridge structure 1a and the concave grooves 1b. COPYRIGHT: (C)2004,JPO
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