| 摘要 |
A high precision size measuring apparatus for measuring a degree of alignment accuracy for elements such as semiconductor elements formed on an object to be measured, such as a semiconductor wafer. The apparatus has a holding portion for fixing thereon the object to be measured, a movable bed for moving the object to be measured, for a first optical system for detecting alignment accuracy of a plurality of elements formed on the object to be measured, and a second optical system different from the first optical system, for detecting alignment of the object to be measured which serves as a reference point for alignment accuracy, having dimensions different from that of the plurality of elements.
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