| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a chip type optical semiconductor element decreases in reliability since the optical semiconductor element of this kind is likely to cause the fall of a gold wire since a wire bonding pad is easy to receive heat during a solder reflow process. <P>SOLUTION: A chip type optical semiconductor element is formed such that a wire bonding pad 2e is led out at the nearly center position of the width of a side where a soldering terminal 2b is provided and connected by a lead-out wire 2f bypassing it nearly in a key shape, and then stress strain which is likely to concentrate to four corners of the chip type optical semiconductor element 1 in a dicing process makes peeling caused between an element substrate 2 and a case 5 during the solder reflow process reach the wiring bonding pad 2e by the repetition of the solder reflow process, thereby preventing the wire bonding pad 2e and the gold wire 4 from causing a defect in contact by bypassing the lead-out wire 2f. <P>COPYRIGHT: (C)2004,JPO |
