| 摘要 |
FIELD: the composition concerns the reaction mixture for manufacture of the elastic layer of the forming compensation pad for the molding press, applicable for molding of foiled dielectrics, glass plastics, perinaxes in electrical engineering, chemical industries for moulding of laminated printed-circuit boards in electrical engineering, ratio engineering, electronic engineering and other industries, as well as for moulding of laminated building materials. SUBSTANCE: composition contains heat-proof rubber with vulcanizing additives containing chlorinated paraffins -470, zinc oxide, sulfur, 2-mercaptobenzothiazole and SAA - emulsifier, as well as fibrous and powder aggregates. EFFECT: enhanced strength of forming pads. 4 cl, 3 tbl, 3 ex |
