| 摘要 |
PROBLEM TO BE SOLVED: To provide capacitors, particularly embeddable capacitors, having high dielectric constant capacitance dielectric materials that are easier to form electrodes on than conventional high dielectric constant capacitance dielectric materials. SOLUTION: Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers. COPYRIGHT: (C)2004,JPO
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