发明名称 |
Dicing method for micro electro mechanical system chip |
摘要 |
A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a photoresist or filler. The dicing method comprises the steps of spraying a liquid photoresist as a protectant of microstructures on a wafer on which the microstructures are installed, and coating the whole surface of the wafer with the photoresist (first step); heat treating the coated wafer at a predetermined temperature for a certain time to remove residual water in the sprayed photoresist and to cure the sprayed photoresist (second step); dicing the heat treated wafer (third step); and removing the photoresist (fourth step).
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申请公布号 |
US2004005735(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
US20030412486 |
申请日期 |
2003.04.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG JOON SEOK;JUNG SUNG CHEON;YOON SANG KEE;LEE HYUN KEE |
分类号 |
H01L21/78;B81C1/00;(IPC1-7):H01L21/44;H01L21/50;H01L21/301 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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