| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system that gives a semiconductor package having a wide cavity. <P>SOLUTION: This system includes a method of wire bonding a fingerprint sensor die 300 to an external circuit. The die 300 has one or more die contacts which are wire-bonded to one or more external contacts of the external circuit so that the utilizable portion 404 of a sensor array is maximized. The method comprises a step of forming balls at the first ends of bonding wires 306 and 308, a step of forming electrical conductive connections between the balls and the selected external contacts of the external circuit, and a step of extending bonding wires to selected die contacts so as to form a wire loop having a low loop height. The method also comprises a step of forming electrical conductive stitch connections between the second end sections of the bonding wires 306 and 308 and the selected external contacts. <P>COPYRIGHT: (C)2004,JPO |
