SEMICONDUCTOR WAFER WITH SPACER AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To form spacers for isolating semiconductor chips with high productivity on the semiconductor chips in a method for enhancing the integration degree by laminating the semiconductor chips and bonding them.

SOLUTION: A mold 40 having a plurality of holes is set on a semiconductor wafer having a plurality of semiconductor elements or a plurality of the semiconductor chips 20 two-dimensionally placed on a substrate 10 and the die is removed after filling paste 49 being a material for a spacer 50 into the holes to form the spacer 50 on the respective chips 20 together.

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