| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board which can be used in a higher frequency band without deteriorating the electrical connection and connection reliability. <P>SOLUTION: Since an IC chip 90 and a daughter board 94 are connected without use of through-hole by providing an aperture 30A to a metal plate 30 corresponding to a core board in the related art, providing a solder portion (solder bump in the related art) 36 to an area which is lower than the surface of board, and then connecting the board to the bump 92 of the IC chip 90 via the solder portion 36, the wiring length can be reduced and the high frequency performance can also be enhanced. Moreover, even when a thick metal plate 30 having higher strength is used, wiring does not become longer and electrical connection property and connection reliability can be improved. <P>COPYRIGHT: (C)2004,JPO |
