METHOD FOR REMOVING SILICONE POLYMER DEPOSIT FROM ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for removing a cured silicone polymer deposit from an electronic component. SOLUTION: The electronic component is dipped in a preheated solution of quaternary ammonium fluoride in a hydrophobic aprotic solvent containing no hydroxyl group under stirring. Next, the electronic component is dipped in a preheated solution containing the hydrophobic aprotic solvent as a main component under stirring. Subsequently, the electronic component is washed with a hydrophilic and substantially water soluble solvent under stirring by spraying. Next, the electronic component is dipped in a water bath, water is sprayed on the electronic component under pressure and dry N2is sprayed on the washed electronic component to dry the same. COPYRIGHT: (C)2004,JPO