METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for fabricating a semiconductor device is provided to position a pad on a semiconductor chip or a pad of a printed circuit board(PCB) or a leadframe by forming an electrode bump on the pad of the chip or the pad of the PCB or the leadframe. CONSTITUTION: The electrode bump is formed on the pad of the semiconductor chip or the pad of the PCB or the leadframe through an electroless plating process to perform an area array packaging. The electroless plating process is performed by injecting a plating solution or dipping a wafer(10) in the plating solution.