发明名称 Package retention module coupled directly to a socket
摘要 A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. The at least one retention arm extends perpendicular to the socket. At least one retention clamp is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.
申请公布号 US6672892(B2) 申请公布日期 2004.01.06
申请号 US20010968403 申请日期 2001.09.28
申请人 INTEL CORPORATION 发明人 CHANDRAN BIJU;GONZALEZ CARLOS A.
分类号 H01R12/04;H05K7/10;(IPC1-7):H01R13/62 主分类号 H01R12/04
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