发明名称 |
Method of increasing tab bond strength using reactive ion etching |
摘要 |
A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
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申请公布号 |
US6668445(B1) |
申请公布日期 |
2003.12.30 |
申请号 |
US20000481254 |
申请日期 |
2000.01.11 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
MRVOS JAMES MICHAEL;RAULINAITIS MICHAEL;SULLIVAN CARL EDMOND |
分类号 |
G03G9/08;H05K3/34;H05K3/36;(IPC1-7):H05B3/00 |
主分类号 |
G03G9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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