发明名称 High-speed chip-to-chip communication interface
摘要 A high-speed parallel interface for communicating data between integrated circuits is disclosed. The interface is implemented by a transmitter and receiver pair and a single- ended parallel interconnect bus coupling to the transmitter and receiver pair. As opposed to transmitting small swing signals over differential signal lines, the transmitter transmits data to the receiver at full swing over the single-ended parallel interconnect bus. The invention can be implemented with simple CMOS circuitry that does not consume large die area. Accordingly, many link interfaces can be implemented on a single chip to provide a large data bandwidth.
申请公布号 US2003236939(A1) 申请公布日期 2003.12.25
申请号 US20030439571 申请日期 2003.05.16
申请人 KLEVELAND BENDIK;ANDERSON ERIC;AYBAY GUNES;FEROLITO PHILIP 发明人 KLEVELAND BENDIK;ANDERSON ERIC;AYBAY GUNES;FEROLITO PHILIP
分类号 G06F13/14;H04L7/00;H04L7/04;H04L25/02;H04L25/45;(IPC1-7):G06F13/14 主分类号 G06F13/14
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