A semiconductor wafer characterized in that the outer circumferential part curved (warped) to rise on the surface of the wafer and curved (roll over) to suspend on the rear surface of the wafer. In the fabrication process of a device, a device pattern can be formed on the wafer with high yield regardless of variation in the shape of the wafer chuck of an aligner in the photolithography process and the wafer can be polished with a uniform finishing allowance at the time of CMP.
