发明名称 Method for mounting electric components with a mounting device
摘要 A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position. The component holder then mounts the electric component on the circuit substrate.
申请公布号 US6665928(B2) 申请公布日期 2003.12.23
申请号 US20010771996 申请日期 2001.01.30
申请人 FUJI MACHINE MFG., CO. LTD. 发明人 SUHARA SHINSUKE
分类号 B23P19/00;B23P21/00;H05K13/02;H05K13/04;(IPC1-7):H05K3/30 主分类号 B23P19/00
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