发明名称 |
Method for mounting electric components with a mounting device |
摘要 |
A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position. The component holder then mounts the electric component on the circuit substrate.
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申请公布号 |
US6665928(B2) |
申请公布日期 |
2003.12.23 |
申请号 |
US20010771996 |
申请日期 |
2001.01.30 |
申请人 |
FUJI MACHINE MFG., CO. LTD. |
发明人 |
SUHARA SHINSUKE |
分类号 |
B23P19/00;B23P21/00;H05K13/02;H05K13/04;(IPC1-7):H05K3/30 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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