发明名称 WAFER CHUCK USED IN SEMICONDUCTOR FABRICATING APPARATUS
摘要 PURPOSE: A wafer chuck used in a semiconductor fabricating apparatus is provided to prevent the outside air from being induced to a chamber through a welded portion by forming a transfer path of pins at the edge of a supporter of a wafer chuck. CONSTITUTION: A plurality of pins(40) are capable of moving vertically. A wafer is placed on the supporter(10) in which the transfer path of the pins are formed. A heater(30) heats the supporter, located under the supporter. The heater is placed on a base(20). The supporter has an area broader than that of the heater. The transfer path is located in the edge of the supporter corresponding to the outer of the heater.
申请公布号 KR20030094681(A) 申请公布日期 2003.12.18
申请号 KR20020031933 申请日期 2002.06.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SANG HWAN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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