发明名称 |
WAFER CHUCK USED IN SEMICONDUCTOR FABRICATING APPARATUS |
摘要 |
PURPOSE: A wafer chuck used in a semiconductor fabricating apparatus is provided to prevent the outside air from being induced to a chamber through a welded portion by forming a transfer path of pins at the edge of a supporter of a wafer chuck. CONSTITUTION: A plurality of pins(40) are capable of moving vertically. A wafer is placed on the supporter(10) in which the transfer path of the pins are formed. A heater(30) heats the supporter, located under the supporter. The heater is placed on a base(20). The supporter has an area broader than that of the heater. The transfer path is located in the edge of the supporter corresponding to the outer of the heater.
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申请公布号 |
KR20030094681(A) |
申请公布日期 |
2003.12.18 |
申请号 |
KR20020031933 |
申请日期 |
2002.06.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, SANG HWAN |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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