发明名称 Semiconductor device
摘要 In an element formation region, a surface of an N<-> epitaxial layer is inclined upward from an end of a field oxide film to a sidewall of an opening. An external base diffusion layer formed on the surface of the N<-> epitaxial layer is inclined upward from a side of the field oxide film to the sidewall of the opening, and is exposed at the sidewall of the opening. A portion of the sidewall of the opening exposing the external base diffusion layer is tapered. A depth of a lower end of the external base diffusion layer on the sidewall of the opening is substantially equal to or smaller than that of a bottom of the opening. With this, decrease in breakdown voltage between an emitter and a base is suppressed, and decrease and variation of a current gain hFE is suppressed.
申请公布号 US2003230788(A1) 申请公布日期 2003.12.18
申请号 US20020286754 申请日期 2002.11.04
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 FUJII HIDENORI
分类号 H01L21/331;H01L21/762;H01L29/08;H01L29/10;H01L29/417;H01L29/732;(IPC1-7):H01L31/032;H01L31/033;H01L27/082;H01L27/102;H01L29/70 主分类号 H01L21/331
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